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Digital Signage Endcap Concept
Demonstration of concept to bring the endcap to life using Intel embedded technology. (4:05)
Electrostatic Discharge Prevention Methods
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Antenna and Oscilloscope: Electrostatic Discharge Detection
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Measuring I/O Shield Alignment
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Intel® LGA115X Socket: System Integration Factory
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Package-on-Package Devices: Ball Grid Array Rework
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Handling Recommendations: Manufacturing with Intel® Products
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Kyowa Strain Gage
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Corner Glue: Application Techniques and Materials
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Intel® LGA115X Socket: Board Factory
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Intel® LGA115X Socket: Mandarin Board Factory
Mandarin: Guide to LGA115X socket independent loading mechanism installation.
Vishay Micro-Measurements Strain Gage
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.