Dashboard

Inhoud zoeken

Verfijnd zoeken
Gerelateerde inhoud

Actieve tags

  • 644 Resultaten
  • Items per pagina

Next-Generation Enterprise Mobility Strategy and Cloud

Forrester Research paper commissioned by Dell and Intel about next-generation enterprise mobility strategy and client-aware cloud capabilities.

Preview | Download

Spotlight: Oracle VM* for Intel® Xeon® Processor E5 Family

Oracle* server virtualization solution built on the Intel® Xeon® processor E5 family goes beyond server consolidation to help IT deliver in the cloud.

Preview | Download

Modernize Your Data Center with Windows Server* 2012 R2

Solution Brief: Upgrade to Windows Server* 2012 R2 and the Intel® Xeon® processor E5 v3 to modernize your data center to meet regulatory requirements.

Preview | Download

China Mobile Shanghai Boosts Billing Efficiency with Cloud

Case Study: China Mobile Shanghai boosts billing efficiency, capacity, and performance with Intel® Xeon® processor E7-based cloud computing platform.

Preview | Download

Intel® Itanium® processors

Intel® Itanium® processors leveren betrouwbare prestaties en ondersteunen de meest veeleisende zakelijke toepassingen van nu.

Data Center Infrastructure: Intel® Xeon® Processor E5 v3 Family

Build data center infrastructure on the Intel® Xeon® processor E5 v3 family with this real-world guide.

Preview | Download

Integrated Network Acceleration of Intel and Microsoft

White paper discusses integrated network acceleration benefits of Intel® I/O Acceleration Technology and Microsoft Windows Server 2008*.

Preview | Download

Intel presents Cedar Trail next-gen Atom platform at IDF 2011

Video: Intel presents Cedar Trail next-gen Atom™ platform at IDF 2011.

Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

Preview | Download

Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

Preview | Download