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Intel® Atom™ Processors N450/D410/D510: Thermal Design Guide

Intel® Atom™ Processors N450/D410/D510: Thermal Design Guide

Introduction

This document describes the thermal characteristics of the Intel® Atom™ processor N450, D410, and D510 and provides guidelines for meeting the thermal requirements imposed on a single-processor system.

The goals of this document are to:
• Identify the thermal and mechanical specification for the device.
• Describe a reference thermal solution that meets the specifications.

A properly designed thermal solution adequately cools the device die temperature at or below the thermal specification. This is accomplished by providing a suitable local ambient temperature, ensuring adequate local airflow, and minimizing the die to local ambient thermal resistance. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

This document describes thermal and mechanical design guidelines for the Intel® Atom™ processors in the micro Flip Chip Ball Grid Array package. For thermal design information on other Intel® components, refer to the respective component datasheets.

Read the full Intel® Atom™ Processors N450/D410/D510 Thermal Design Guide.

Intel® Atom™ Processors N450/D410/D510: Thermal Design Guide

Introduction

This document describes the thermal characteristics of the Intel® Atom™ processor N450, D410, and D510 and provides guidelines for meeting the thermal requirements imposed on a single-processor system.

The goals of this document are to:
• Identify the thermal and mechanical specification for the device.
• Describe a reference thermal solution that meets the specifications.

A properly designed thermal solution adequately cools the device die temperature at or below the thermal specification. This is accomplished by providing a suitable local ambient temperature, ensuring adequate local airflow, and minimizing the die to local ambient thermal resistance. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

This document describes thermal and mechanical design guidelines for the Intel® Atom™ processors in the micro Flip Chip Ball Grid Array package. For thermal design information on other Intel® components, refer to the respective component datasheets.

Read the full Intel® Atom™ Processors N450/D410/D510 Thermal Design Guide.

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