Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Mandarin: Guide to LGA115X socket independent loading mechanism installation.