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Connector Model Quality Assessment Methodology

Intel® Connector Model: Quality Assessment Methodology

This quality assessment methodology document defines the type of models that are used to describe connector behavior and recommends how best to evaluate model accuracy and define the quality (qualification) levels for electrical models.

Scope

The scope of this document is limited to the quality assessment of connector geometric and electrical models. Via models are outside the scope of this document.

Geometric/Material

These models are typically used by the most advanced designers and they are usually distributed only under carefully detailed non-disclosure agreements. The primary objective filled by use of these models is accurate 3D model combination also known as concatenation and electrical performance analysis of the connector+via stack.

A primary customer may want advanced information that enables the customer to optimize their own footprint designs to take advantage of the best characteristics of the connector being developed with custom via structures and board stack-ups. Such objectives can be achieved by use of software capable of analyzing the combination of connector, via and board geometric designs.

The geometric model often does not contain material properties, metal plating types and thicknesses. This information and the 3D models are both required to accurately model the electrical behavior of the structure.

Read the full Intel® Connector Model: Quality Assessment Methodology.

Intel® Connector Model: Quality Assessment Methodology

This quality assessment methodology document defines the type of models that are used to describe connector behavior and recommends how best to evaluate model accuracy and define the quality (qualification) levels for electrical models.

Scope

The scope of this document is limited to the quality assessment of connector geometric and electrical models. Via models are outside the scope of this document.

Geometric/Material

These models are typically used by the most advanced designers and they are usually distributed only under carefully detailed non-disclosure agreements. The primary objective filled by use of these models is accurate 3D model combination also known as concatenation and electrical performance analysis of the connector+via stack.

A primary customer may want advanced information that enables the customer to optimize their own footprint designs to take advantage of the best characteristics of the connector being developed with custom via structures and board stack-ups. Such objectives can be achieved by use of software capable of analyzing the combination of connector, via and board geometric designs.

The geometric model often does not contain material properties, metal plating types and thicknesses. This information and the 3D models are both required to accurately model the electrical behavior of the structure.

Read the full Intel® Connector Model: Quality Assessment Methodology.

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